The spontaneous formation of a hard non-reactive surface film (usually an oxide or nitride) that inhibits further corrosion
The changing of the chemically active surface of a metal to a much less reactive state Contrast with activation
The process of making a material passive (non-reactive) in relation to another material prior to using the materials together
The conversion of a metal surface to a less reactive state A process used to reduce the corrosion rate of a metal surface
The technique of providing a protective, isolating coating on the top of a semiconductor device Usually silicon dioxide is grown to provide this coating, but other materials are also used, such as glass See glassivation
The phenomenon by which a metal, although in conditions of thermodynamic instability, remains indefinitely unattacked because of modified or altered surface conditions
A protective layer of oxides on the surface of a metal which resists corrosion This passive oxide layer is the chief reason why stainless steels have such good corrosion resistant properties It is a natural phenomenon, but can be accelerated by special passivating solutions that can be applied to tubular products by an optional process
The process of transferring an enterprise bean from memory to secondary storage (See activation )
A protective layer of oxides on the surface of a metal which resists corrosion This passive oxide layer is the primary reason stainless steels have such excellent corrosion resistance
The conversion of a metal surface to a less reactive state A process used to reduce the corrosion rate of metal surfaces
A layer of insulating material deposited over a wafer or a region of a device to stabilize and protect the surface against moisture, contamination, and mechanical damage Silicon dioxide or silicon nitride are often used for IC passivation
The treatment of metallic surfaces to create a non-reactive surface aiding in reduction of absorption and corrosion
Protection of the junctions and surfaces of solid state electronic components and ICs from harmful environments; most commonly achieved by forming a layer of silicon dioxide on the silicon chip
Deposition of a scratch-resistant material, such as silicon nitride and/or silicon dioxide, to prevent deterioration of electronic properties caused by water, ions, and other external contaminants The final deposition layer in processing (SM*)
Usually a silicon dioxide or silicon nitride layer deposited last to seal the circuit to protect it from moisture and/or contamination The passivation layer is patterned and etched to open up on the bonding pads
When exposed in air, stainless steels passivate naturally (due to the presence of chromium) But the time required can vary In order to ensure that the passive layer reforms rapidly after pickling, a passivation treatment is performed using a solution of nitric acid and water