surface mount technology

الإنجليزية - الإنجليزية

تعريف surface mount technology في الإنجليزية الإنجليزية القاموس.

method of assembling printed circuit boards where the components are mounted onto the surface of the board rather than being inserted into holes in the board

printed circuitry in which surface mounted component leads are soldered to the top level conductors of the PCB

The technology used when components are mounted to the surface of circuit boards Surface mount technology allows smaller component size, improves signal speed, increases reliability and automation in manufacturing, and requires less handling of parts

A technique of assembling SMDs or SMCs on the surface of PCBs and PWAs, as opposed to wiring them through holes Surface mount technology offers a number of important advantages, but also some disadvantages, such as difficulty in defluxing under certain types of SMD

Board assemblies using leaded and leadless electronic components

A method of assembling hybrid circuits and printed wiring boards where component parts are mounted onto, rather than into, the printed-wiring boards, as in the mounting components on substrates in hybrid technology

The process of assembling printed circuit boards with components soldered to the surface rather than to plated through-holes

A method of soldering electrical components directly to a board substrate that uses less space than the pin-through-hole method

smt

الواصلة

sur·face mount tech·no·lo·gy

التركية النطق

sırfıs maunt teknälıci

النطق

/ˈsərfəs ˈmount tekˈnäləʤē/ /ˈsɜrfəs ˈmaʊnt tɛkˈnɑːləʤiː/